I moved to Los Angeles in August 2025 to join USC. Please contact me at limsung@usc.edu. Here is my new personal website.

My impact factors

• My Google Scholar
• My ORCID (Open Researcher and Contributor ID): 0000-0002-2267-5282

My talk (selected)

• 2023 ERI Summit in Seattle, "3D IC EDA: What is Needed, and How/When Can We Deliver?", >2,000 Attendees (click the photo to view)
  
  

My awards (selected)

• Class of 1940 Course Survey Teaching Effectiveness Award (Institute-level Teaching Award based on Student Course Survey): 2016, 2018, 2019, 2020, 2021, 2022, 2025.
• Donald O. Pederson Best Paper Award, IEEE Transactions on Computer-Aided Design, 2022. News Release.
  
  
  
  
• IEEE Fellow, IEEE Council on Electronic Design Automation. News Release.
• Best Paper Award, ACM Design Automation Conference, 2023. News Release.
  
  
  
  

My chips

• The world's first many-core 3D IC from academia: The 3D-MAPS Processors (2012)
  
  

My media coverage (selected)

1. 2D tools adapt to create smaller monolithic 3DIC designs: Tech Design Forum (June 2016)
2. GlobalFoundries, Arm Close in on 3D Chip Integration: IEEE Spectrun (Auguest 2019)
3. Stacking Memory On Logic, Take Two: Semiconductor Engineering (September 2019)

Other info

• My curriculum vitae
• GT-KAIST Dual BS/MS Programs